Product Description: Asem Copper filling plating product has coveraged  HDI/FPC and IC substrate, Including high-speed filling,
　　　　　　　　　　  Ultra-thin copper filling  all have core product applications.

Product features: Good appearance and filling performance；
 Thinner copper thickness; Good stability of plating bath

Applied to:  HDI/FPC IC substrate with blind via-filling and through-hole plating